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Teardrop (electronics)
In printed circuit boards, a teardrops are typically drop-shaped features at the junction of vias or contact pads and traces.
The main purpose of teardrops is to enhance structural integrity in presence of thermal or mechanical stresses.〔("Component placement tips and strategies" ), EDN Network〕 Structural integrity may be compromised, e.g., by misaligment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via.〔("Enhanced Teardrop Control" ), Altium Designer technical documentation〕 An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper.〔("Why Where When and how teardrops should be added to PCB? " ), Kaizen Technologies〕
While a typical shape of a teardrop is straight-line tapering, they may be concave.〔 To produce a "snowman"-shaped teardrop, a secondary pad of smaller size is added at the junction overlapping with the primary pad (hence the nickname).〔("PCB Design Guidelines for 0.5mm Package-on-Package Applications Processor, Part I" ), Texas Instruments, Application Report SPRABB3, June 2010 (retrieved July 27, 2015)〕
==References==
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